AKASA Pro Grade+ 5022

Technically advanced heat-resistant paste with silicone guarantees excellent heat dissipation and improves the stability and reliability of your computer. Because of the new production technology, it contains much smaller particles that increase thermal conductivity and thus transfer heat more quickly between the heat sink and the processor. With its parameters and silicone used, it minimizes non-conductivity and maximizes the efficiency of the cooler. The heat conductive paste can be used on any processor, graphics processor or chipset. The tube contains 3.5 grams of paste, which is applied directly to the processor where the heat sink comes into contact with it. The whole tube is sufficient for multiple uses.
Parameters and Specifications:
Colour:
Grey
 
Adhesion:
102K cPs  
Thermal conductivity:
4W/mK
Operating temperature:
- 45°C to 200°C
Weight:
3.5g
Certification:
RoHS
Note: It must be applied in a very thin layer and only at the points of direct contact with the chip condenser.