Zalman Thermal Compound ZM-STG1

Brand thermal paste designed to improve heat conductivity between the heat source and the cooler. It is intended for common use for processors, graphics cards, chipsets, memory cards and more. It also improves the contact between both parts, helping to reduce the temperature and prolong the life of expensive integrated circuits. In addition, the paste is completely non-conductive, so there is no risk of short-circuiting due to accidental spraying of the components.
Properties:
Thermal conductivity: 1.2 W/m.K
Operating temperature: -50 to 170°C
Storage temperature: below 10°C
Quantity: 1.5g
Note: The grease must be applied in a very thin layer and only to the points of direct contact between the chip with the cooler.